PostDoc position on Wafer Bonding Physics for 3D Chip Integration

Posted 2026-09-20 by @tenuretracker.bsky.social

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PhysicsComputer SciencePostdocNetherlands
University of Twente is hiring: PostDoc position on Wafer Bonding Physics for 3D Chip Integration #postdoc #engineering #waferbondingphysics --- Extract: The University of Twente offers a 2-year postdoctoral position in the XUV Optics group to investigate wafer bonding physics for 3D chip integration. Candidates should have a PhD in relevant fields and experience with surface analysis techniques.
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